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- 7th Advanced 3D Printing Expo Date June 19, 2024 – June 21, 2024 City/country Tokyo / Japan / Asia Exhibits Metal 3D Printing,Metal 3D Printing Materials,Outsourcing 3D Printing,Resin 3D Printing,Resin 3D Printing Materials,3D Data Solutions,Molding Machines/Processing Machines,Measuring Instruments/Measurement Machines,Other Related Technologies
- 2nd INDUSTRIAL ODM/EMS EXPO Date June 19, 2024 – June 21, 2024 City/country Tokyo / Japan / Asia Exhibits Contract Manufacturing & OEM, EMS, Assembly & Inspection, Manufacturing Dispatch, Manufacturing Consulting etc.
- 7th Industrial AI/IoT Expo Date June 19, 2024 – June 21, 2024 City/country Tokyo / Japan / Asia Exhibits AI Solutions / IoT Platforms / IoT Gateways / Sensor Network & Devices / Cloud Computing / Control Systems / Wearable Devices / Network Modules & Devices / Security / Big Data Management / Mobile Devices / Data Centers / Remote Control Systems / Measuring Instruments etc.
- 7th Aerospace Technology & Components Expo Date June 19, 2024 – June 21, 2024 City/country Tokyo / Japan / Asia Exhibits Ultra-precision, difficult-to-cut materials processing,advanced composite materials, highly functional materials, connectors, power supplies, mechanical parts, driving components,measuring machines/tools, sensors, fasteners, bolts, fluid power transmissions,tubes, testing,simulators, molds, jig
- 6th Measure/Test/Sensor Expo [MeasureTech] Date June 19, 2024 – June 21, 2024 City/country Tokyo / Japan / Asia Exhibits Measurement Equipment,Test Equipment,Industrial Microscope,Positioning Technology,Inspection Equipment,Weighing Equipment,Industrial Camera,Switch,Sensor,Nondestructive Measuring Instrument,Environmental Measuring Instrument,Other Measurement Product etc.
- 15th Medical Device Development Expo Date June 19, 2024 – June 21, 2024 City/country Tokyo / Japan / Asia Exhibits Mechanical Components,Deburring Technologies,Fluid Power Technologies,IT Solutions,Sterilization Products,Motors,Motion Technologies,Washers,Cleaners,Prototype Manufacturing,Cutting technologies,Casting/Molding,Electronic Components,Connectors,Cables,Vacuum Pumps,Tube Pumps,Measurement Devices,Testing Devices,Sensors,Medical Device OEM/ODM,Disposable Product OEM/ODM,Surface Coating,Surface Treatment,Needles,Tubes etc.
- 2nd MANUFACTURING DIGITAL TRANSFORMATION EXPO Date June 19, 2024 – June 21, 2024 City/country Tokyo / Japan / Asia Exhibits Management & Cross-Organizational IT, Transaction IT, Procurement & Purchasing & Quotations IT, Quality IT, Logistics IT, Maintenance & Preservation IT, Technology Transfer & Education IT etc.
- 36th Manufacturing World Japan Date June 19, 2024 – June 21, 2024 City/country Tokyo / Japan / Asia Exhibits CAD, CAE, production management system, 3D printer, bearings, screws, springs, processing technology, measuring equipment, deburring machines, trial production, OEM, 3DCG technology, high-definition display, etc.
- JFEX 2024 – 4TH JAPAN INT’L FOOD EXPO Date June 19, 2024 – June 21, 2024 City/country Tokyo / Japan / Asia Exhibits Instant Food,Confectionery/Snack,Vegetable, Fruit,Seafood,Wine,Beer,Sake,Whisky,Meat,Processed Meat,Milk,Cheese
- 8th “JAPAN’S FOOD” EXPORT FAIR Date June 19, 2024 – June 21, 2024 City/country Tokyo / Japan / Asia Exhibits Agri-food,Meat,Seafood,Processed Food,Confectionery,Beverage,Seasoning,Tableware/Kitchen Tool,Export Assistance Company,Logistics Company
- Total Solution Exhibition for Electronic Equipment 2024 Date June 12, 2024 – June 14, 2024 City/country Tokyo / Japan / Asia Exhibits Electronic circuit technology, high-density mounting technology, electronic component mounting technology, new circuit formation technology, electrical / optical transmission technology, sensor technology, semiconductor / electronic component, high-performance textile, optical device / laser technology, deep ultraviolet (DUV) market / State-of-the-art LED application technology, image processing / sensing technology, Process technology/materials/equipment, environmental systems, logistics systems, etc.
- 2024 Microelectronics Show Date June 12, 2024 – June 14, 2024 City/country Tokyo / Japan / Asia Exhibits High-density/high-frequency mounting technology applied products, high-density substrates/interposers, component-embedded substrates, semiconductor chips, system-in-package (SiP)/system-on-chip (SoC), display/optical devices, centered on cutting-edge future technologies / Sensors, high-density mounting-related materials, various pastes, lead-free solder/joining materials, sealing resins, adhesives, underfill materials, heat countermeasure materials and materials, high-frequency compatible polymers, various bonders (wire bonders, die bonders, LCD/ COG bonder, etc.), dispenser, flip chip (FC) mounting, BGA/CSP assembly, TAB mounting, OLB/ILB system, COB system, etc.
- JPCA Show 2024 ( International Electronic Circuits Exhibition) – PWB Tech Date June 12, 2024 – June 14, 2024 City/country Tokyo / Japan / Asia Exhibits Various printed wiring boards, other wiring boards, functions & parts & structures & other various designs, design support tools, electromagnetic field analysis (EMC / EMI / SI measures), CAE support equipment such as CAD & CAM & CIM, inspection, evaluation & analysis systems, wiring boards & Various substrate materials, mold making, plate making, plating process & chemicals, manufacturing & treatment equipment, water & waste & soil pollution & air pollution control systems, energy saving, logistics & logistics & inventory management systems, etc.
- JPCA Show 2024 (International Electronic Circuits Exhibition) – Module Japan Date June 12, 2024 – June 14, 2024 City/country Tokyo / Japan / Asia Exhibits Various straight, package, interposer, built-in electronic circuit board, WLCSP / WLP, BGA (CSP), LGA, QFN, chip parts, bare die, various modules, function & logic design technology, other various design & support tools, electromagnetic field analysis (EMC / EMI / SI measures), CAE support equipment such as CAD & CAM & CIM, inspection & evaluation & analysis system, various alloys, wiring & board material, polyimide film / tape, ceramic substrate material, silicon wafer, glass blanks, plating & mold Manufacturing technology, materials and equipment, chemical processing, photographic exposure equipment, machining, transport, coating, washing, etc., various manufacturing equipment, environmental and energy saving systems, logistics systems, inventory management systems, security, traceability management, etc.
- METAVERSE DEVICE EXPO Date June 12, 2024 – June 14, 2024 City/country Tokyo / Japan / Asia Exhibits General products and technologies related to Metaverse (semiconductors, processors, memory, sensors) AR/VR/MR goggles, displays (micro LED, organic EL), cameras, headsets, controllers, cooling devices, etc.
- JPCA Show 2024 (International Electronic Circuits Exhibition) – EMS Japan Date June 12, 2024 – June 14, 2024 City/country Tokyo / Japan / Asia Exhibits Printed wiring mounting boards, module mounting boards, other electronic circuit mounting boards, memory and storage devices, transistors, diodes, optical semiconductors, microcomputers, dedicated ICs, general-purpose linear ICs, various design technologies and tools, CAD, CAM, CAE, Mounting board / Semiconductor integrated circuit inspection & evaluation & analysis, circuit board and other main materials, mounting board manufacturing equipment & process materials and equipment, water quality / waste / air pollution / soil pollution countermeasures system, energy saving, logistics & logistics & inventory management system ,etc
- WIRE Japan Show 2024 Date June 12, 2024 – June 14, 2024 City/country Tokyo / Japan / Asia Exhibits Industrial equipment, wires/cables and connectors, wire processing machines, wiring components, wire harnesses, measuring instruments for wires/cables, (wires/cables/harnesses) manufacturing equipment, inspection machines, related books, etc.
- JISSO PROTEC 2024 Date June 12, 2024 – June 14, 2024 City/country Tokyo / Japan / Asia Exhibits Electronic component placement machine, electronic component insertion machine, cream solder printing machine, soldering device (reflow oven), dispenser, transport system, taping machine & material, bulk feeder & other feeder, automatic assembly device, wire bonder, die bonder, flip chip Mounting system, LCD / COG bonding system, BGA / ILB system, COB system, board appearance inspection device, semiconductor manufacturing related inspection & measurement device, other mounting related inspection & measurement device, design tool, production optimization software, mounting programming device , SMD, semiconductor package parts, small electronic parts, chip parts, connectors & sockets, switches, bulk supply parts, taping reels, carrier tapes, TAB tapes / reels, magazine sticks, IC trays, bulk cases, soldering equipment, soldering / Joining material Underfill material, the high-frequency-enabled device & parts & material, environment-related equipment and material
- COMNEXT 2024 Date June 26, 2024 – June 28, 2024 City/country Tokyo / Japan / Asia Exhibits Next Generation Communication Solutions (Local 5G/IoT/Wi-Fi6/Edge AI, etc.), 5G/6G communication technologies, 5G/6G materials, Optical communication technology (FOE), Image transmission and 8K technology, NEXT STAGE (Organizer’s plan, next-generation technologies, etc.)
- FOOMA JAPAN 2024 – International Food Machinery & Technology Exhibition Date June 4, 2024 – June 7, 2024 City/country Tokyo / Japan / Asia Exhibits Food raw material processing, food manufacturing/processing, engineering, robot/IT/IoT/food tech, freshness control/quality maintenance, packaging/filling, storage/conveyance/movement, measurement/analysis/inspection, hygiene measures/management, environmental measures/ Energy saving/recycling, equipment/technology/parts, consultants/patents, information services/organizations, etc.